Inline PCBA patch 3D optical inspection
AIS43X
A new generation of light source system, so that defects nowhere to hide
3D visual inspection technology, truly restore 3D information
AI intelligent algorithm support, improve the detection accuracy
Lightweight integrated frame, the whole machine runs faster and more stable
Compatible with high-low device imaging, real object information
It is compatible with real-time HD photography of high devices and small materials, and improves the image quality of screen printing by adjusting the Z-axis height of specific devices of specific FOV. It can be compatible with up to 25mm devices.
AI intelligent denoising height restoration 3D imaging
Multi-angle projection and multi-frequency fringe structure light fusion solve the image overexposure problem, integrate AI intelligent denoising function, highly restore the 3D image of the measured object, provide accurate 3D number.
High precision defect detection ensures zero leakage of defects
By returning to the solder climbing state, the sectional area, size and Angle are measured to reduce the impact of imaging on measurement, and effectively detect defects such as solder spot welding, less tin, and more tin.
Inspection case
Specification
12MP
彩色工业面阵相机
RGB+W四色
积分光源
15um@60*45mm
分辨率&FOV
可测板卡尺寸
50*50mm-510*460mm（大板模式定制尺寸支持690*460mm）
注：以上参数为标准配置，若有特殊需求可评估定制;资料仅供参考,如有变动，以实物为准。
12MP
彩色工业面阵相机
RGB+W四色
积分光源
10um@60*45mm
分辨率&FOV
可测板卡尺寸
单轨：50x50mm-510x610mm（大板模式支持690x610mm）；
双轨：50x50mm-510x330mm（大板模式支持690x330mm）（中间两轨道间距最小55mm）
注：大板模式下只可左进板或右进板
双轨：50x50mm-510x330mm（大板模式支持690x330mm）（中间两轨道间距最小55mm）
注：大板模式下只可左进板或右进板
注：以上参数为标准配置，若有特殊需求可评估定制;资料仅供参考,如有变动，以实物为准。
