Inline PCBA solder paste inspection
AIS63X
Stable detection of defects, improve production straight-through rate
Multi-directional structured light imaging generates high-precision 3D images
Fusion AI intelligent denoising, real restoration of solder paste imaging
Strong anti-interference, high detection, low false positives
High precision imaging scheme, true restoration of solder paste imaging
AI intelligent denoising is integrated to restore the real and objective solder paste imaging. The specially developed light source scheme makes SPI adapt to the identification of PCB pads of different colors and materials, and improves the imaging accuracy.
Simple and easy to learn programming, programming efficiency is higher
AI intelligent programming, one click to generate the whole board image, intelligent configuration parameters, does not rely on engineer experience, higher program consistency.
Three-point lighting, assist to quickly locate abnormal causes
Integrate the inspection data of SPI, pre-furnace AOI and post-furnace AOI, quickly analyze product defects, locate the root cause, and help engineers develop targeted improvement measures to improve the situation of defective products and increase the yield of good products in the production line.
Inspection case
Specification
AIS630B
AIS630B-D
AIS630P
5MP
彩色面阵高速工业相机
RGB三色
积分光源+单方向结构光投影单元
15um@36*30mm
分辨率&FOV
可测板卡尺寸
50*50mm-510*460mm(大板模式支持710*460mm)
注:大板模式只可左进板或右进板
注:以上参数为标准配置,若有特殊需求可评估定制;资料仅供参考,如有变动,以实物为准。
5MP
彩色面阵高速工业相机
RGB三色
积分光源+单方向结构光投影单元
15um@36*30mm
分辨率&FOV
可测板卡尺寸
单轨:50*50mm-510*610mm(大板模式支持710*610mm);
双轨:50*50mm-510*330mm(大板模式支持710*330mm)
注:大板模式只可左进板或右进板
注:以上参数为标准配置,若有特殊需求可评估定制;资料仅供参考,如有变动,以实物为准。
5MP
彩色面阵高速工业相机
RGB三色
积分光源+单方向结构光投影单元
15um@36*30mm
分辨率&FOV
可测板卡尺寸
50*50mm-510*460mm(大板模式支持710*460mm)
注:大板模式只可左进板或右进板
注:以上参数为标准配置,若有特殊需求可评估定制;资料仅供参考,如有变动,以实物为准。
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