Inline PCBA solder optical inspection
AIS30X
High precision imaging, true restoration of solder joint sharp
AI intelligent algorithm, covering various solder detection items
Minimal programming, automatic identification of solder joints throughout the board
Multi-dimensional extraction of bad features of holes, strong detection ability
Professional multi-color integral light source, true restoration of solder joint sharp
Different angles of RGB light source irradiation, accurately reflect the slope information of the surface of the object, so that the solder joint layer is more obvious, clearly showing the solder defects.
AI intelligent algorithm automatically identifies the solder joints of the whole board
Based on big data +AI deep learning algorithm training, covering more than 97% of solder joint models, realizing automatic identification of solder joints of the whole board, and configuring detection algorithms to automatically adjust parameters.
Multi-dimensional feature extraction, stable identification of complex items
The model based on big data training has strong detection ability and generalization ability, which can correct the alarm caused by the diversified deviation of solder joints, and solve the problem of missing and false alarm caused by the large change of solder joints components and the easy effected of pins and devices.
Inspection case
Specification
AIS303B
AIS303B-L
12MP
彩色工业面阵相机
RGB+W四色
积分光源
15um@60*45mm
分辨率&FOV
可测板卡尺寸
三段式轨道:50*50mm-350*400mm;单段式轨道:50*50mm-450*400mm
注:以上参数为标准配置,若有特殊需求可评估定制;资料仅供参考,如有变动,以实物为准。
12MP
彩色工业面阵相机
RGB+W四色
积分光源
15um@60*45mm
分辨率&FOV
可测板卡尺寸
50*50mm-550*650mm(大板模式支持710*650mm)
注:大板模式下只可左进板或右进板
注:以上参数为标准配置,若有特殊需求可评估定制;资料仅供参考,如有变动,以实物为准。
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