Inline PCBA double-sided optical inspection
AIS50X
Both sides simultaneous detection, for product quality escort
Multi-dimensional extraction of tens of thousands of features, bad detection ability
Special research light source and algorithm to meet the needs of special device detection
Final inspection after reflow soldering, after DIP wave soldering, or before packaging
Specially developed light source system, better imaging effect
Independently developed multi-channel light source, compatible with devices, patches, solder joints and other different detection items, effectively improve the image saturation and brightness. Combined with AI intelligent seamless jigsaw technology, shooting stitching is more natural.
Strong ability to detect and identify complex projects
The model based on big data training is compatible with complex conditions such as device deviation, capacitor skew, solder joint shape change, similar color, irregular arrangement of devices, etc., and has strong detection ability.
Special research CPU pin matching algorithm, strong detection ability
Special light source to improve the pin imaging effect, combined with the CPU pin matching algorithm, 1 minute to complete the entire CPU pin programming, covering of bad type detection, support the pin point, and body Bad detection of skew, fracture, foreign body, sinking, deformation, missing needle.
Inspection case
Specification
AIS501
AIS501B
AIS501-L(链条)
12MP
彩色工业面阵相机
RGB+W四色
积分光源
15um@60*45mm
分辨率&FOV
可测板卡尺寸
皮带&链条款:50*50mm-510*460mm(大板模式支持730*460mm);
滚轮款:50*50mm-430*460mm(大板模式支持730*460mm)
注:以上参数为标准配置,若有特殊需求可评估定制;资料仅供参考,如有变动,以实物为准。
12MP
彩色工业面阵相机
RGB+W四色
积分光源
15um@60*45mm
分辨率&FOV
可测板卡尺寸
皮带&链条款:50*50mm-510*460mm(大板模式支持730*460mm);
滚轮款:50*50mm-430*460mm(大板模式支持730*460mm)
注:以上参数为标准配置,若有特殊需求可评估定制;资料仅供参考,如有变动,以实物为准。
12MP
彩色工业面阵相机
RGB+W四色
积分光源
15um@60*45mm
分辨率&FOV
可测板卡尺寸
50*50mm-510*650mm(大板模式支持730*650mm)
注:大板模式下只可左进板或右进板
注:以上参数为标准配置,若有特殊需求可评估定制;资料仅供参考,如有变动,以实物为准。
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